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The area of the end plate was 177 cm2 and that of the cylinder plasma-spraying technique combined with a melt-reaction method. substrates or nickel-buffered copper substrates by a low-pressure The films were deposited onto end plates and cylinder walls of silver in the TEOU mode over a temperature range from 4.2 K to 300 K. measured using a demountable copper cavity operated at 3 GHZ The microwave surface resistance of YBaCuO thick films was

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