Moisture diffusion properties of the polyimide HFPE-II-52 were determined using weight gain, weight loss, and swelling experiments over a temperature range of 25-2008C. Below 1008C, diffusivity was measured using standard weight loss and weight gain methods. Above 1008C, diffusivity is found by weight loss experiments performed by placing moisture saturated samples in an oven and recording weight loss dynamically. The diffusivity of the polyimide was found to obey the Arrhenius relation over the entire range of temperature. Weight gain experiments were performed to determine the equilibrium level of moisture absorbed by the polyimide as a function of relative humidity. Swelling experiments were performed to measure swelling strain as a function of moisture absorption.
The domain of Electrical Computer-Aided Design and Engineering (ECAD/ECAE) has been subject to major and rapid change over the past couple of years. Electrical Engineering Computer-Aided Design (CAD) tools developed in the early to mid-1990s no longer meet future requirements. Consequently, a new generation of Electrical Engineering CAD systems has been under development for about a decade now. An overview of advances in this field is presented in the introductory part of this paper. This overview also sets the context and provides background information for the main topic, MCAD-ECAD-integration, to be addressed in the remainder of this paper. Many complex engineered systems encompass mechanical as well as electrical engineering components. Unfortunately, contemporary CAE environments do not provide a sufficient degree of integration in order to allow for multi-disciplinary product modeling and bi-directional information flow (i.e. automated design modifications on either side) between mechanical and electrical CAD domains. Overcoming this barrier of systems integration would release a tremendous efficiency potential with regard to the efficient development of multidisciplinary product platforms and configurations. An overview of the state-of-the-art in MCAD-ECAD integration is presented. In addition, associated research questions are postulated and potential future research perspectives discussed.
Mechatronic systems encompass a wide range of disciplines and hence are collaborative in nature. Currently the collaborative development of mechatronic systems is inefficient and error-prone because contemporary design environments do not allow sufficient information flow of design and manufacturing data across the electrical and mechanical domains. Mechatronic systems need to be designed in an integrated fashion allowing designers from both electrical and mechanical engineering domains to receive automated feedback regarding design modifications throughout the design process. Integrated design of mechatronic products can be realized through the integration of mechanical and electrical CAD systems. One approach to achieve this type of integration is through the propagation of constraints. Cross-disciplinary constraints between mechanical and electrical design domains can be classified, represented, modeled, and bi-directionally propagated in order to provide automated feedback to designers of both engineering domains. In this paper, the authors focus on constraint classification and constraint modeling and provide a case study example using a robot arm. The constraint modeling approach presented in this paper represents a blueprint for the actual implementation.
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