Despite significant advances in touch and force transduction, tactile sensing is still far from ubiquitous in robotic manipulation. Existing methods for building touch sensors have proven difficult to integrate into robot fingers due to multiple challenges, including difficulty in covering multicurved surfaces, high wire count, or packaging constrains preventing their use in dexterous hands. In this paper, we present a multicurved robotic finger with accurate touch localization and normal force detection over complex, three-dimensional surfaces. The key to our approach is the novel use of overlapping signals from light emitters and receivers embedded in a transparent waveguide layer that covers the functional areas of the finger. By measuring light transport between every emitter and receiver, we show that we can obtain a very rich signal set that changes in response to deformation of the finger due to touch. We then show that purely data-driven deep learning methods are able to extract useful information from such data, such as contact location and applied normal force, without the need for analytical models. The final result is a fully integrated, sensorized robot finger, with a low wire count and using easily accessible manufacturing methods, designed for easy integration into dexterous manipulators. P. Piacenza and M. Ciocarlie are with the
Micro light-emitting diode (microLED) structures were modeled and validated with fabricated devices to investigate p-type GaN (pGaN) contact size dependence on power output efficiency. Two schemes were investigated: a constant 10 μm diameter pGaN contact and varying microLED sizes and a constant 10 μm diameter microLED with varying contact sizes. Modeled devices show a 17% improvement in output power by increasing the microLED die size. Fabricated devices followed the same trend with a 70% improvement in power output. Modeled microLED devices of a constant size and varying inner contact sizes show optimized power output at different current densities for various contact sizes. In particular, lower current densities show optimized output for smaller pGaN contacts and trend towards larger contacts for higher current densities in a balance between undesirable efficiency losses at high-current injection and preventing surface recombination losses. We show that for all device geometries, it is preferential to shrink the pGaN contact to maximize efficiency by suppressing surface recombination losses and further improvements should be carefully considered to optimize efficiency for a desired operational brightness.
A burn‐in measurement technique was realized and tested for both standard and high dynamic range (HDR) organic light emitting diode (OLED) displays. The proposed measurement targets analyze wide color gamut, non‐RGB primary, and HDR displays. The system was implemented in commercial OLED displays to validate the proposed measurement system.
Ultrahigh‐resolution micro light‐emitting diode (LED) displays are emerging as a viable technology for self‐emissive displays. Several of the critical issues facing micro LED displays with millions of pixels are fidelity, process control, and defect analysis during LED fabrication and transfer. Here, we investigate two non‐destructive test methods, photoluminescent and cathodoluminescent imaging, and compare them with electroluminescent images to verify LED fidelity and evaluate these methods as potential tools for defect analysis. We show that utilizing cathodoluminescent imaging as an analysis tool provides a rich data set that can identify and categorize common defects during micro LED display fabrication that correspond to electroluminescence. Photoluminescent imaging, however, is not an effective method for fidelity analysis but does provide information on dry‐etching uniformity.
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