We propose high speed optical interconnection which is three dimensional optical lanes using polymer materials fabricated on an organic circuit board with metal lines and pads. These optical lanes transmit optical signals not only on a plane surface but into the other side of a circuit board. It has following three particular portions; (1) Curved parallel optical waveguide; (2) 45 degree reflection mirror; (3) Optical via hole.Four channel three dimensional optical lanes with current electrical lines and pads are newly developed on the organic circuit board named CPCore TM . We characterize the optical lanes by transmission loss and passed through eye diagram, and optical signal transmission is confirmed.Then optical signal transmission up to 3Gbps/channel are demonstrated with 850nm VCSEL flip-attached on the circuit board with active and passive electronic devices and components as driving circuit.
Optical lines using polymer materials fabricated on an organic substrate with metal lines and pads are proposed to realize fully optical interconnections among high performance LSIs. This optical line enable transmit high speed optical signals not only on a plane surface but to vertical direction. It has following four particular portions; (1) Curved parallel optical waveguide; (2) 45 degree reflection mirror; (3) Optical via hole with coaxial structure; (4) Optical joint between package and board. The optical line characterized by transmission loss and passed through eye diagram, and good optical signal transmission is confirmed to really use for optical interconnection between LSIs. Then on-board optical signal transmission is demonstrated by that VCSEL and PIN-PD are assembled using flip-chip technology on a circuit board with other electric devices of driving circuit, and also package-to-board optical joint are demonstrated by passing through solder reflow process.
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