Cubic-structured HfLaO embedded tetragonal ZrO2 is investigated for application to a dynamic random access memory capacitor dielectric. It is found that hole injection is the determining factor of the leakage current in the ZrO2–HfLaO stack and thus HfLaO should be kept away from the electrode interface due to its smaller valance band offset than that of ZrO2. The insertion of cubic-structured HfLaO into tetragonal ZrO2 with an optimized thickness combination can effectively reduce the equivalent oxide thickness without increasing the leakage current.
The origin of flat band voltage shift phenomena using arsenic ion-implant in High-k/Metal Inserted Poly Si (HK/MIPS) gate stacks was investigated. Arsenic ionimplantations were carried out on HfSiO and HfSiON dielectric layers. Precise arsenic profile was obtained through front and backside SIMS analysis. From the electrical and physical analysis, we verified that the flat band voltage was shifted due to an arsenic dipole formation at high-k/metal interface. The negative shift of 480mV was obtained with the optimized arsenic ion implant condition.
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