A 5 GHz differential power amplifier (PA) module with a dipole antenna has been implemented. The PA integrated circuit (IC) was mounted on a fluoroplastic substrate on which the dipole antenna was fabricated. The differential PA IC was fabricated using 0.18 μm Si-CMOS process. For the differential operation, an n/nMOS push-pull circuit was employed. The PA IC was directly connected to the balance input of dipole antenna without a balun using stud bump bonding on a fluoroplastic substrate. The antenna was designed using a 3-dimensional electromagnetic simulator including a feed line. The measured gain of the PA module was 12.6 dB at 5 GHz.
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