Demand for printed electronic devices is increasing, likewise the attention being paid to through-hole electrodes as an integration approach. In comparison with wire bonding integration methods, through-hole electrodes occupy smaller surface areas and have lower power consumption rates. Generally, the diameters of through-holes fabricated in flexible substrates are larger than those developed in rigid substrates. In this study, ultraviolet nanoimprint lithography was used to fabricate microscale through-holes in a flexible substrate, and these holes were subsequently filled with silver ink to form through-hole electrodes.

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We study a parallel blower system that is mQdelled by a set of the third order autonoumous ordinary differntial equations ． The system can be recognized as a dual system to the 且 ip−fiOp c 呈 rcuit model ， which Moser et ai examined in details ， and it has been shown 七 hat various nonlinear phenomena such as bi血 rcations ， 丘shhook structures and chaotic behaviors are appeared ． In this paper ， we wnl explore bifurcation of the parallel blower system ；especially ， two dimens正 onal bifurcatioll by using a one dimensional map induced by a Poincare map ． Finally ， employing the one dimellsional map as the third parameter， we will illustrate three dimensional structures appeared

In recent years, flexible electronic devices such as printed electronics are gathering attention. To make flexible connect between one circuit device and another circuit device, interposer is necessary. However, most of conventional interposers are not flexible, because there are made of silicon or glass substrate. To solve this problem, we have been developed fabrication process of flexible interposer. Master mold was fabricated by photolithography process. First, SU-8 resist was coated on silicon substrate with 5μm thickness. Then, photolithography process was carried out to SU-8 resist. After development, pillar shape master molds with diameters of 10 or 20 μm were obtained. After release coating of master molds, hole patterns for vias were transferred by UV nanoimprint lithography. The obtained hole patterns were diameter of 10 μm or 20 μm, and pitch of 21.0 μm and 40.1 μm, respectively. Next, these holes were filled with silver ink by roll press method. Then, sintering process was carried out to evaporate of solvent of silver ink. After that, flexible interposer was obtained. As a result, we have been succeeded in filling the holes array with silver ink. Obtained interposer vias, which were silver region, were 8.2 μm diameter and 3.3 μm height, or 20.3 μm diameter and 5.3 μm height for 10 mm square size.