Abshclef -Small size radlo frequency (RQ multi chip module for dual band (ZAG& and SG€Iz) wireless local area network ( % " I arulications is described. The full 11. DESIGN OF THE RF MODULE -.. funclIona between base band inpuWontpnt WO) and RIi mteuna switch are integrated in tbe RF modde. In order to reduce size Of the RR module, embedded 5GRz band pass fdter 0, build-up multi-layer o q m i c substrate and lip RF module in this paper the between base band U0 and RF a " switch for dual band WLAN systems. The block diagram iS shown in c h i technology are used. &of them module is 24mm 32mm I 2. 1", hClUdhg shield COVW and EOnUeEtOFJ. This is the mioimum size in modules with same functions for dual band WLAN as far as the authors know. And e l e c h i d performances of the RF module ue evaluated using WAN denals. This reuort rresents desien and exrelimental nosults figure I. It is found that the architecture of W c e i v e r is Two 1es, 1c1 and IC2, are used in the RF module' IC' is the and demodulatcJr of base band in-phdq-me VQ) signals and intermediate kcluency (IF) Sigds. IC1 also ofsmaU alze RF.modole for dual band e applications. chip modules, wireless LAN. Indcx Term -band pars lilters, Bip chip devices. multi I. INTRODUCTTON5GHz W A N systems [l] arc increasing in the wireless communication market because they have such advantages of higb data transmission rate and spectnun availability. One of the features of wireless communication systems is mobility and so the 5GHz WLAN stations are needed to be small size [21-[5]. On the other hand, the 2.4GHz band WLAN systems were staudardjzed earlier than the 5GHz band systems and have been already deployed in many areas. Therefore, WLAN stations are required to be operated in the dual band, both of 2.4GHz and 5GHz. And RF modules for the dual band W A N applications were reported recently [61-[71. Small size, low height and low cost are very important factors for the RF modules of dual band WLAN stations because the RF module are used as small cards of pemnal computers or mounted on the substrates in mobile phones. In this report, we used embedded fdters in the substrate, not chip filters on the substrates. That means not only small sue but also low height and low cost And the organic build-up substrates and flip chip technology were selected for the same purposes. This paper describes the design and experimental results about the RF module for dual band WLAN applications. has the variable attenuators for changing gain of the transceiver paths. IC2 is the up-conveaer and downmverter of IF signals and RF si&. And IC2 includes voltage controlled oscillator (VCO) and phase-locked loop (PLL) circuit for IF-local signals and RF-local signals. Y Crystal M r e n m ICl: 0rlhqon.l ModulldodD.mMulato~ IC2 Upman CMMrler and VCOlPLL Fig. 1. Block Diagram of RF Module for dual band WLAN In the transmitter path, power amplifiers (€'A's) for 2.4GH and 5GHz are used in order to boost the output power of IC2 to the proper level. 2.4GHz signals and 5GHz signals are supplied to a ...
FPGAs (Field Programmable Gate Array) are now widely used for prototyping systems as well as mid-volume products. These FPGAs are fabricated by the leading edge CMOS process technology. These may excite false logic transition due to simultaneous switching CMOS output buffers [1]-[4]. In this paper, simultaneous switching noise of FPGA was investigated by both measurement and simulation. First, a precise circuit model was established by extracting the leadframe inductance of the package and including on-chip decoupling capacitance. The power supply impedance of an evaluation board was also simulated. Then, measured waveforms were compared with time-domain simulated results. The simulated time-domain waveforms showed a good agreement with measured waveforms. Moreover, ringing frequency of the measured waveforms was well correlated with the peak of the power supply impedance.
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