The synergistic effects of 2,2′-bipyridyl and potassium hexacyanoferrate(II) on the plating rate and the deposit quality were examined in the triethanolamine (TEA) electroless copper bath. The simultaneous addition of 2,2′-bipyridyl and potassium hexacyanoferrate(II) enhanced not only the plating rate but also the foil quality. The elongation of the foil produced in the TEA bath containing these two additives was 10 times larger than that produced in the bath containing only 2,2′-bipyridyl. The analysis based on the adsorption model revealed that the simultaneous addition of 2,2′-bipyridyl and potassium hexacyanoferrate(II) increases the respective adsorption equilibrium constants. From the analysis, the synergistic effects was attributed to the adsorption of 2,2′-bipyridyl and potassium hexacyanoferrate(II) on the surface with mutual interactions.
With the addition of potassium hexacyanoferrate(II) to the 2,2′2″-nitrilotriethanol (TEA) electroless copper bath, the effects of the plating rate and the deposit quality were examined. The required concentration to improve the quality of the TEA bath was 10 times higher than that in the ethylenediaminetetraacetic acid (EDTA) bath.
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