Efficient p-type doping in CdTe has remained a critical challenge for decades, limiting the performance of CdTe-based semiconductor devices. Arsenic is a promising p-type dopant; however, reproducible doping with high concentration is difficult and carrier lifetime is low. We systematically studied defect structures in As-doped CdTe using high-purity single crystal wafers to investigate the mechanisms that limit p-type doping. Two As-doped CdTe with varying acceptor density and two undoped CdTe were grown in Cd-rich and Te-rich environments. The defect structures were investigated by thermoelectric-effect spectroscopy (TEES), and first-principles calculations were used for identifying and assigning the experimentally observed defects. Measurements revealed activation of As is very low in both As-doped samples with very short lifetimes indicating strong compensation and the presence of significant carrier trapping defects. Defect studies suggest two acceptors and one donor level were introduced by As doping with activation energies at ~88 meV, ~293 meV and ~377 meV. In particular, the peak shown at ~162 K in the TEES spectra is very prominent in both As-doped samples, indicating a signature of AX-center donors. The AX-centers are believed to be responsible for most of the compensation because of their low formation energy and very prominent peak intensity in TEES spectra.
We analyze charge-carrier dynamics using time-resolved spectroscopy and varying epitaxial CdTe thickness in undoped heteroepitaxial CdTe/ZnTe/Si. By employing one-photon and nonlinear two-photon excitation, we assess surface, interface, and bulk recombination. Two-photon excitation with a focused laser beam enables characterization of recombination velocity at the buried epilayer/substrate interface, 17.5 μm from the sample surface. Measurements with a focused two-photon excitation beam also indicate a fast diffusion component, from which we estimate an electron mobility of 650 cm2 (Vs)−1 and diffusion coefficient D of 17 cm2 s−1. We find limiting recombination at the epitaxial film surface (surface recombination velocity Ssurface = (2.8 ± 0.3) × 105 cm s−1) and at the heteroepitaxial interface (interface recombination velocity Sinterface = (4.8 ± 0.5) × 105 cm s−1). The results demonstrate that reducing surface and interface recombination velocity is critical for photovoltaic solar cells and electronic devices that employ epitaxial CdTe.
Minority-carrier lifetimes have simultaneously been measured on a single-crystal CdTe sample using three transient decay techniques. These measurements are microwave-reflection photoconductive decay (μ-PCD), time-resolved photoluminescence (TRPL), and transient free-carrier absorption (TFCA). The sample is a 0.8-mm-thick single-crystal CdTe sample from JX Nippon Mining & Metals USA, Inc., which is nominally undoped but has a hole concentration of about 2 − 3 × 10 14 cm −3 . Excess carriers are generated using a Nd:YAG laser with ß5-ns pulses, and lifetimes are measured at room temperature. Using 532-nm excitation, the decay curves show an initial short-lifetime component, as carriers are generated near the unpassivated front surface. While TRPL shows a short lifetime of ß7 ns, both μ-PCD and TFCA have relatively long single-exponential decays after the initial 100 ns response. These decay times, which are more dominated by the bulk lifetime after the initial surface recombination, are ß190 ns for both μ-PCD and TFCA. Simultaneous measurements using twophoton (1064 nm) excitation show bulk-dominated recombination for all three techniques. Lifetimes for both μ-PCD and TFCA are 270 ns, while the TRPL lifetime, which still shows some surfacelimited initial decay, is 160 ns.
A set of neighboring multicrystalline silicon wafers has been processed through different steps of solar cell manufacturing and then images were collected for characterization. The imaging techniques include band-to-band photoluminescence (PL), defect-band or subbandgap PL (subPL), and dark lock-in thermography (DLIT). Defect regions can be tracked from as-cut wafers throughout processing to the finished cells. The finished cell's defect regions detected by band-to-band PL imaging correlate well to diffusion length and quantum efficiency maps. The most detrimental defect regions, type A, also correlate well to reversebias breakdown areas as shown in DLIT images. These type A defect regions appear dark in band-to-band PL images, and have subPL emissions. The subPL of type A defects shows strong correlations to poor cell performance and high reverse breakdown at the starting wafer steps (as-cut and textured), but the subPL becomes relatively weak after antireflection coating (ARC) and on the finished cell. Type B defects are regions that have lower defect density but still show detrimental cell performance. After ARC, type B defects emit more intense subPL than type A regions; consequently, type B subPL also shows better correlation to cell performance at the starting wafer steps rather than at the ARC process step and in the finished cell.
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