A new trend in complex SoC design is chiplet-based IP reuse using 2.5D integration. In this paper we present a highly-integrated design flow that encompasses architecture, circuit, and package to build and simulate heterogeneous 2.5D designs. We chipletize each IP by adding logical protocol translators and physical interface modules. These chiplets are placed/routed on a silicon interposer next. Our package models are then used to calculate PPA and signal/power integrity of the overall system. Our design space exploration study using our tool flow shows that 2.5D integration incurs 2.1x PPA overhead compared with 2D SoC counterpart.
As students are going through their academics and pursuing their interested courses, it is very important for them to assess their capabilities and identify their interests so that they will get to know in which career area their interests and capabilities are going to put them in. This will help them in improving their performance and motivating their interests so that they will be directed towards their targeted career and get settled in that. Also recruiters while recruiting the candidates after assessing them in all different aspects, these kind of career recommender systems help them in deciding in which job role the candidate should be kept in based on his/her performance and other evaluations. This paper mainly concentrates on the career area prediction of computer science domain candidates.
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