Optical wireless LANs have the potential to provide bandwidths far in excess of those available with current or planned RF networks. There are several approaches to implementing optical wireless systems, but these usually involve the integration of optical, optoelectronic, and elec-I Figure 5. Demonstration system optomechanics. Transmitter optomechanics Receiver optomechanics Detector array flip-chip bonded to CMOS integrated circuit Ceramic package Ceramic package Source array flip-chip bonded to CMOS integrated circuit
TI-Ba-Ca-Cu-0 thin films have been grown on a variety of substrates, both with and without the use of buffer layers. Differences in processing routes required for the various film-substrate combinations are highlighted and the effect of the buffering layers on the microstructure, transport and microwave properties of the films are discussed.
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