Thermal
interface materials (TIMs) that function as reducing the
contact thermal resistance between chip and cooling solution are indispensable
in modern electronics. The development of electronics toward reduced
feature size and being wearable has led to the need for new TIMs with
both heat dissipation and high energy dissipation. However, the strong
coupling between storage modulus and energy dissipation makes it difficult
for TIMs to acquire these two properties simultaneously. Here, we
propose an anneal-induced disentanglement strategy to obtain excellent
heat dissipation properties of TIMs in a vibration environment, which
is difficult for traditional TIMs. The dissociation of partially introduced
dynamic covalent bonds in the polymer matrix releases the trapped
entanglement and reduces storage modulus during the annealing process.
Using prototypical dynamic thioester cross-linked polybutadiene adducted
with maleic anhydride (PAMA), we achieved thioester-TIMs with tan
δ higher than 0.94 in the frequency range of daily life, which
is 4.7 times higher than that of traditional TIMs. In the actual application
of 10 Hz vibration frequency, no temperature fluctuations (∼0
°C) are detected when using the thioester-TIMs chips, while the
use of traditional TIMs show fluctuations of ∼3 °C. Such
excellent performance creates new opportunities for TIMs design, and
addresses current limitations in TIMs for flexible electronic packaging.
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