Low-pressure chemical vapor deposition of graphene has been investigated on various Pt substrates such as e-beam deposited films, sputtered films, and polycrystalline foils. High temperature sputtering is found to be crucial in growing single layer graphene on Pt. It gives highly (111)-oriented crystallization with a significant reduction of dewetting in Pt films, in contrast to e-beam deposited Pt films. Graphene grown on high temperature sputtered Pt films is free of micro-sized multilayer graphene islands normally observed in graphene grown on polycrystalline Pt foils. This indicates that using Pt thin films can effectively suppress the multilayer graphene growth by carbon segregations and precipitations from the Pt bulk. Growth of single layer graphene is demonstrated on Pt films with a thickness down to 25 nm. Effects of the Pt substrates on the as-grown graphene have been investigated. An XY plot of the Raman G and 2D bands in graphene shows a correlation with the surface facet orientations of the Pt substrates measured by electron backscatter diffraction. With a general red shift of the G band distributions, a blue shift of the 2D band distributions is observed, which goes as high as ~ 2750 cm -1 in graphene grown on Pt (111) films.
Here, we demonstrate the fabrication of a Cu-graphene heterostructure interconnect by the direct synthesis of graphene on a Cu interconnect with an enhanced performance. Multilayer graphene films were synthesized on Cu interconnect patterns using a liquid benzene or pyridine source at 400 °C by atmospheric pressure chemical vapor deposition (APCVD). The graphene-capped Cu interconnects showed lower resistivity, higher breakdown current density, and improved reliability compared with those of pure Cu interconnects. In addition, an increase in the carrier density of graphene by doping drastically enhanced the reliability of the graphene-capped interconnect with a mean time to failure of >106 s at 100 °C under a continuous DC stress of 3 MA cm−2. Furthermore, the graphene-capped Cu heterostructure exhibited enhanced electrical properties and reliability even if it was a damascene-patterned structure, which indicates compatibility with practical applications such as next-generation interconnect materials in CMOS back-end-of-line (BEOL).
A large-scale MoS2 thin film with a holey structure enhances the in-plane Seebeck thermopower, resulting in an enhancement of the Seebeck thermopower anisotropy.
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