We prepared and characterized nanocomposites of polyethylene oxide (PEO)/polyethylene glycol-polyhedral oligomeric silsesquioxane (PEG-POSS), all of which incorporated a KI/I 2 salt system, as electrolytes. Differential scanning calorimetry was used to investigate their melting and crystallization behaviors and to measure their respective degrees of crystallinity over mixing wide range of compositions. The degree of crystallinity reduced with POSS content, indicating restricted segmental motion of the polymer chains. Morphological observations were made using a polarized microscope, and the spherulite patterns observed in PEO/KI/I 2 collapsed with added POSS. A decrease in storage modulus was also observed by dynamic mechanical analysis. The ion conductivity measured by electrochemical impedance spectroscopy was enhanced from 1.19 × 10 −5 to 1.27 × 10 −4 S·cm −1 at 70 wt% POSS; presumably, this was due to the combined effects of lower crystallinity, lower glass transition, and lower modulus as POSS content increases. C 2015 Wiley Periodicals, Inc. Adv Polym Technol 2015, 34, 21499; View this article online at wileyonlinelibrary.com.
초록: 본 연구에서는 endo-dicyclopentadiene(endo-DCPD)의 경화반응 속도 및 에폭시수지와의 접착강도를 조사하였Abstract: The cure kinetics of endo-dicyclopentadiene (endo-DCPD) and the bonding strength to epoxy were investigated in this study. To increase the bonding strength, norbornene carboxylic acid (NCA) and norbornene methanol (NM) were used as adhesion promoters. The endo-DCPD monomer containing various contents of NCA or NM adhesion promoters was reacted with the 1 s t generation and the 2 n d generation Grubbs catalysts via a ring-opening metathesis polymerization (ROMP), and the dynamic cure behavior was measured using differential scanning calorimetry (DSC). The effects of Grubbs catalysts and adhesion promoters on the curing kinetics of endo-DCPD were characterized using the dynamic DSC analysis and the model-free isoconversion method. From the result of the adhesion test for epoxy resins with endo-DCPD, the bonding strength was increased by the adhesion promoters, which is ascribed to the hydrogen bond formation between the epoxy resin and the adhesion promoters.
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