A highly thermally conductive heat spreader for applications in electronic devices is becoming increasingly demanding, and therefore the removal of excess heat requires an efficient heat dissipating device. Boron nitride nanosheets (BNNSs) were prepared as thermally conductive fillers using hexagonal boron nitride (h-BN) powder as raw material by a water exfoliation method. A composite film was prepared by vacuum filtration using cellulose nanofibers (CNFs) as the substrate with an in-plane thermal conductivity (TC) of 82.4 W m−1 K−1, thermal conductivity enhancement increasing by 9,486% compared to pure cellulose film. Thus, CNF/BNNS composite films are promising as effective thermal interface materials (TIMs) in electronic devices and electronic component applications.
The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m−1 K−1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.
Due to their excellent biocompatibility, outstanding
mechanical
properties, high strength-to-weight ratio, and good corrosion resistance,
titanium (Ti) alloys are extensively used as implant materials in
artificial joints. However, Ti alloys suffer from poor wear resistance,
resulting in a considerably short lifetime. In this study, we demonstrate
that the chemical self-assembly of novel two-dimensional (2D) diamond
nanosheet coatings on Ti alloys combined with natural silk fibroin
used as a novel lubricating fluid synergistically results in excellent
friction and wear performance. Linear-reciprocating sliding tests
verify that the coefficient of friction and the wear rate of the diamond
nanosheet coating under silk fibroin lubrication are reduced by 54
and 98%, respectively, compared to those of the uncoated Ti alloy
under water lubrication. The lubricating mechanism of the newly designed
system was revealed by a detailed analysis of the involved microstructural
and chemical changes. The outstanding tribological behavior was attributed
to the establishment of artificial joint lubrication induced by the
cross binding between the diamond nanosheets and silk fibroin. Additionally,
excellent biocompatibility of the lubricating system was verified
by cell viability, which altogether paves the way for the application
of diamond coatings in artificial Ti joint implants.
To deal with the heat dissipation problem produced by a high integrated circuit, the preparation of heat spreaders with excellent heat transportation performance is increasing in demand. The Ti3C2 MXene sheets and copper particles were fully contacted with cellulose nanofibers by a high-speed mixer, and the composite film was prepared as a heat spreader under the action of the vacuum-assisted filtration. The MXene sheets are connected by the esterification of the carboxyl group in MXene and the hydroxyl group in cellulose nanofibers to form a chemical bond and consist of the main skeleton of the composite film. Due to the synergistic effects of MXene and copper particles, the in-plane and out-of-plane thermal conductivities of the composite film reach 24.96 and 2.46 W m−1 K−1, respectively. Compared with the pure cellulose nanofiber films, the thermal conductivity of composite films increased by 2819.2 and 187.6%, respectively. By designing two applications of composite films in the actual use process, the excellent heating conduction abilities in two directions have been proved. This measure to improve the thermal conductivities of composite films by MXene-copper binary fillers also provides ideas for the novel heat spreader.
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