Pharmacogenetics (the study of inter‐individual inherited variations in DNA sequence related to drug response) is increasingly gaining recognition as an integral part of modern drug development and health care because it provides significant opportunities to increase the safety and efficacy of medicines. The challenge for the pharmaceutical industry and the regulators is exactly how and when to integrate pharmacogenetics to deliver on this potential. There are numerous aspects to consider when determining the data requirements for a regulatory submission to support labeling claims based on genotype. Regulators are committed to fostering a collaborative approach with key stakeholders to address the issues and to develop guidelines as judiciously as possible. It is recognized that pharmacogenetics research must be integrated into an appropriate regulatory framework that does not stifle development of the science nor the applications that will benefit patients. Dialogue, together with a willingness to share experiences of pharmacogenetics in drug development, is critical to moving forward. Drug Dev. Res. 62:102–111, 2004. © 2004 Wiley‐Liss, Inc.
ArF lithography has been successfully implemented for the development of sub-lOOnm DRAM devices. Such issues as CD (critical dimension) slimming during in-line SEM inspection and low dry etch resistance especially for SiN etch conditions, however, are still latent showstoppers for the production with ArF process. To overcome these problems, there are many efforts for continuous improvements in terms of material and process together with intensive study of new inspection tool and dry etch system,.The curing process is one of promising candidates to stabilize the weak ArF resists. Many kinds of curing processes including e-beam curing, thermal curing, plasma curing, UV curing, and VUV (172nm) curing have been studied, and some of them have shown good effects until now. The new curing process with VUV (172nm) showed the most promising results. SEM induced CD slimming of ArF resist improved with 10 sec curing and D/E resistance highly increased with the curing. And there was no particle increase unlike e-beam curing process. And we also found that the re-flow of ArF resist with high Tg above degrathtion temperature was possible with the VUV curing. In this paper, the mechanism and properties ofVUV curing processes will be discussed.
An integrated multilayer antenna-in-package (AiP) targeted for stationary 60-GHz communication is presented. The key differences in design conditions for mass-market-level and prototype-level AiP are discussed and reflected during the design process. Hence, a low-cost and high-reliability package solution is realized. The proposed AiP consists of a 4 6 array of 24 stacked circular patch antennas and corresponding antenna feed lines designed for phased array. The finalized LTCC AiP prototype features 20 15 1.02 mm in dimension. Solder bump flip-chip technology is used to attach the AiP to the RFIC for system-level assembly. The assembled package is evaluated using a custom-designed near-field measurement setup. EM simulations and measurements confirm the presented AiP features more than 9 GHz bandwidth, 45 beam-steering ranges in both -and -planes, and more than 14.5 dBi gain at boresight.Index Terms-Analog beamforming, antenna-in-package (AiP), low-temperature co-fired ceramics (LTCC), millimeter-wave, patch antenna.
The 3D geometry of the RF coil in use is often unavailable when the RF coil is a commercial one or the RF coil has been developed through ad hoc modification of the coil shape at the laboratory. Without the coil geometry information, making a 3D model of the RF coil may be necessary to simulate the RF coil performance using a finite difference time domain (FDTD) solver. We used a stylus‐type 3D tracker to measure the 3D positions of the landmarks on the coil wires. From the measured landmark positions, we built 3D models of the coil wires using a 3D design tool. We also carried out FDTD simulation of the RF coil performances after transferring the 3D model data to the FDTD solver. For demonstration, we built 3D models of a shoulder coil and a 36‐channel helmet‐style array coil, and we computed B1 field maps of the coils using the FDTD solver. We think the proposed method can be greatly used for FDTD simulation of the RF coils in use whose geometries are unknown. © 2013 Wiley Periodicals, Inc. Concepts Magn Reson Part B (Magn Reson Engineering) 43B: 126–132, 2013
A multi-band antenna, which consists of a diversity antenna in the DCS/PCS/UMTS bands and a MIMO antenna in the LTE17/LTE4 bands, is proposed and designed for mobile handset applications. The proposed antenna consists of the meandered PIFAs with branch lines. The radiation efficiency of the proposed antenna is higher than 30% in the LTE17/LTE4 bands and higher than 40% in the DCS/PCS/UMTS bands. The ECC between two identical antennas is less than 0.5 over the entire LTE17/LTE4/DCS/PCS/ UMTS bands.
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