The phase transitions of Ge2Sb2Te5 (GST) films after bombardment with 40keV N2+ ions were investigated. Comparing the nitrogen incorporated GST films with a pure GST film, the suppression of a crystalline grain growth was more effective in the N2+ implanted GST film than in a nitrogen codeposited GST film, i.e., x-ray diffraction data showed that the intensities of the crystalline diffraction peaks were decreased and the full widths at half maximum were broader than that of a pure GST film. This suppression of crystallization owing to the incorporation of nitrogen drastically reduced the roughness of surface morphology and decreased the electrical conductivity of the crystalline film. A near edge x-ray absorption fine structure experiment and x-ray photoemission spectroscopy data demonstrated that the suppression of crystalline grain growth is due to the formation of Ge3N4 and interstitial N2 molecules. In N2+ implanted GST films, in particular, interstitial N2 molecules played a major role in the suppression of crystallization.

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Multilayer films composed of alternating layers of Bi and Se[Bi(4.55 Å)/Se(6.82 Å)] n (Bi4Se6), [Bi(6.13 Å)/Se(12.26) Å] n (Bi6Se12), and [Bi(4.86 Å)/Se(18.46 Å)] n (Bi4Se18)were fabricated by controlling the layer thickness at the atomic scale using thermal evaporation techniques. After annealing treatment, the Bi4Se18 alternately layered film shows a single phase of Bi2Se3 rhombohedral crystalline structure with the characteristic density of single crystal Bi2Se3, whereas the Bi6Se12 and Bi4Se6 films show locally disordered Bi2Se3 crystalline structure. The effectively controlled layered structure in the as-grown Bi4Se18 film enhances the Bi–Se chemical bonding state. The formation of a layered crystalline structure during the annealing process increased as the thickness of Se increased. After interdiffusion and the crystallization process, alternately layered Bi4Se18 films become stable Bi2Se3 single crystals with a continuous and uniform layered structure. Finally, in the Bi–Se system, atomically controlled multilayers with an optimized ratio of each unit layer can be transformed to a perfect single-crystalline structure on oxidized Si with an amorphous phase through a self-organized ordering process.

We investigated the impact of excess oxygen on positive bias temperature stress (PBTS) instability of self-aligned coplanar amorphous InGaZnO thin-film transistors. We focus on the interface region which is compositionally differentiated from the bulk material on each side. The threshold voltage shift under PBTS is proportional to the extracted density of interface trap states that act as electron traps. The density of interface trap states is extracted from capacitance-voltage measurements with monochromatic light of varying wavelengths. We introduce a figure-of-merit that quantifies the amount of excess oxygen relative to the metal cation composition in the interface region. Minimization of interfacial excess oxygen from 112.4% to 101.2% reduces the density of interface trap states by a factor of 2.77, resulting in improvement of PBTS instability from a threshold voltage shift value of 4.42 V to 0.35 V.

We demonstrate top-gate and bottom-gate structures of amorphous indium-gallium-zinc-oxide thin-film transistors and compare their device operation. A replica material stack is fabricated for depth profile characterization to correlate with device results. We mainly focus on the oxygen content at the top and bottom. Key process factors that affect device reliability are determined based on material analysis, subgap densityof-states extraction by monochromatic photonic capacitancevoltage technique, and device simulations. We found that top-gate devices are influenced by higher deep acceptor-like states under positive gate bias-temperature stress, whereas the bottom-gate devices suffer reliability degradation under negative gate bias-temperature stress due to the decrease in oxygen content at the bottom interface. Index Terms-Amorphous InGaZnO (a-IGZO), thin-film transistor (TFT), subgap density of states (DOS).

Te/Sb/Ge and Sb/Te/Ge multilayer films with an atomically controlled interface were synthesized using effusion cell and e-beam techniques. The layers interacted during the deposition, resulting in films composed of Sb-Te+Sb-Sb/Ge and Sb/Sb-Te/Ge-Te/Ge respectively. Atomic diffusion and chemical reactions in films during the annealing process were investigated by photoemission spectroscopy. In the case of Te/Sb/Ge, Ge diffused into the Sb-Te region released Sb in Sb-Te bonds and interacted with residual Te, resulting in a change in valence band line shape, which was similar to that of a Ge(1)Sb(2)Te(4) crystalline phase. The Ge-Sb-Te alloy underwent a stoichiometric change during the process, resulting in a 1.2:2:4 ratio, consistent with the most stable stoichiometry value calculated by ab initio density-functional theory. The experimental results strongly suggest that the most stable structure is generated through a reaction process involving the minimization of total energy. In addition, Ge in the Sb/Te/Ge film diffused into Sb-Te region by thermal energy. However, Ge was not able to diffuse to the near surface because Sb atoms of the high concentration at the surface were easily segregated and hindered the diffusion of other elements.

Decomposition of the positive gate‐bias temperature stress (PBTS)‐induced instability into contributions of distinct mechanisms is experimentally demonstrated at several temperatures in top‐gate self‐aligned coplanar amorphous InGaZnO thin‐film transistors by combining the stress‐time‐divided measurements and the subgap density‐of‐states (DOS) extraction. It is found that the PBTS‐induced threshold voltage shift (ΔVT) consists of three mechanisms: (1) increase of DOS due to excess oxygen in the active region; (2) shallow; and (3) deep charge trapping in the gate insulator components. Corresponding activation energy is 0.75, 0.4, and 0.9 eV, respectively. The increase of DOS is physically identified as the electron‐capture by peroxide. Proposed decomposition is validated by reproducing the PBTS time‐evolution of I–V characteristics through the technology computer‐aided design simulation into which the extracted DOS and charge trapping are incorporated. It is also found that the quantitative decomposition of PBTS‐induce ΔVT accompanied with the multiple stretched‐exponential models enables an effective assessment of the complex degradation nature of multiple PBTS physical processes occurring simultaneously. Our results can be easily applied universally to any device with any stress conditions, along with guidelines for process optimization efforts toward ultimate PBTS stability.

An excess oxygen‐peroxide‐based model that can simultaneously analyze the positive‐bias‐stress (PBS) and negative‐bias‐illumination‐stress (NBIS) instabilities in commercial self‐aligned top‐gate (SA‐TG) coplanar indium–gallium–zinc oxide (IGZO) thin‐film transistors (TFTs) is proposed herein. Existing studies have reported that the transition of oxygen vacancy (VO) charge states from VO0 to VO2+ is the dominant physical mechanism responsible for the negative shift of threshold voltage (VTH) under NBIS. However, in this study, it is observed that both the PBS and the NBIS stabilities of IGZO TFTs deteriorate at a faster rate as the amount of oxygen increases within the channel layer, implying that the conventional VO‐related defect model is inappropriate in elucidating the PBS and NBIS instabilities of commercial SA‐TG coplanar IGZO TFTs, where the channel layers are formed under high oxygen flow rates (OFRs) to make VTH positive. On the basis of the full‐energy range subgap density of states extracted before and after each stress from IGZO TFTs with different OFRs, it is determined that the generation and annihilation of the subgap states in the excess oxygen peroxide configuration are the dominant physical mechanisms for PBS and NBIS instabilities in commercial SA‐TG coplanar IGZO TFTs, respectively.