A new class of interconnects that exhibit resilience to mechanical deformation are demonstrated with flexible fan-out or embedded-die packages. Active device embedding in flexible substrates is accomplished with direct printed interconnects onto die pads. Such a planar fan-out interconnect technology with a low-cost manufacturable process-flow results in the lowest electrical parasitics compared to flipchip with adhesives or printed-ramp interconnections with surface-assembled devices. The interconnects are made with conductive flexible silver-elastomer composites to sustain elastic deformation. The process is also modified to realize flexible backside-assembled fan-out interconnections where the backside of the die is accessible.
In this work, we show the use of tunable ceramic type integrated passive devices for mm-wave antenna applications. The specific illustrations are made using BST (barium strontium titanate) based capacitator, whose capacitances can be changed by electronically controlled permittivity of the BST material. BST capacitors with capacitance variation from 0.5 pF to 1 pF are designed (requiring a control voltage between 0 to 5 V) and using these capacitors, RF-components are designed. Specifically, we show a design of reconfigurable band-pass filter in 28 GHz band and reconfigurable phase-shifters in 28 GHz and 38 GHz mm Wave bands. We show that the electronic control provides enough phase-shift variation for ±90° beam-steering antennas covering the entire broadside scanning range in 28 GHz and 38 GHz bands. Furthermore, bandpass filter that is reconfigurable around 28 GHz band is designed to demonstrate full band reconfigurability to block undesired signals that enter the receiver chains for jamming applications.
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