Based on analysis of field reliability information a reliability model proper for engineering is developed and demonstrated. The development of the model is performed by applying the well known but often forgotten scientific method in which theoretical models are continuously compared with observations and subsequently modified/further developed until a reasonable consistency has been achieved. The tools used are by no means advanced. The model presented has been applied successfully in many industrial case studies, one of which will be described in the paper.
Methods of statistically analysing data from electronic component lifetests are discussed. Particular emphasis is given to analysis techniques using the assumptions of constant hazard rate (Exponential distribution), the Weibull distribution and mixed Weibull distributions. The methods used for analysing Weibull data when the data itself is non-uniform due to both removal of test samples during test and also the non-continuance of surveillance of components under test are discussed. Attention is finally given to the effect of two or more failure mechanisms which can produce S-shaped patterns when data is plotted on Weibull Graph paper.Numerous examples are given, mainly from the field of analysis of CMOS circuit components.
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