A method to fabricate thermoplastically deformable electronic circuits is presented, with the intent of achieving low-cost 2.5D free-form rigid smart objects. This by utilizing existing flexible circuit technology based stretchable circuits, in combination with thermoplastic materials. After fabricating the circuit in a flat state, a thermoforming step shapes the device by heating it beyond its glass transition temperature, and pushing it against a mold. Preliminary tests show the feasibility to fabricate simple circuits using off-the-shelf circuit components; showing a minimal decrease in conductivity of the polyimide supported copper-based interconnects.
α-GalCer analogues that combine known Th1 polarizing C6''-modifications with a C-glycosidic linkage were synthesized. We employed a protecting group strategy that allowed the preparation of both saturated and unsaturated derivatives with variable C6''-substituents. Selected analogues demonstrate promising activity in mice. Interestingly, the introduction of a 6''-O-pyridinylcarbamoyl substituent to α-C-GalCer restores its antigenicity in human iNKT cells.
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