Nowadays, Ball Grid Array, BGA technologies are prevalent through the IC packaging industry. Among them are larger numbers of I/Os, leading to many advantages over conventional ones and low cost assemblies for mass production. BGA packages are compatible with surface mount technology (SMT). BGA uses solder joints as surface mount components (SMC). It is not only used for the conduction of electrical signals, power and ground. It also acts as mechanical support to hold the package in position on a printed circuit board (PCB). Thus, solder joint strength is a major concern for BGA packages. To evaluate the strength of the solder joint attached to the package and PCB, a popular method to use is the ball shear test. In this study, the focus of interest was on the size of the ball, the diameter of solder resistance opening, ball height and shear tool clearance by using finite element method. The experiment design aimed to find out the best conditions for the ball. The results were validated by other authors for suitable correlation. The standard deviation of the parameters concerning ball shear test value was also defined.
The swaging process is commonly used in head stack assembly, which is a process that is undertaken to either reduce or increase the diameter of tubes or rods. In the head stack assembly process, a swage boss engages with an arm hole of E-Block. Current hard disk drives have very small tolerances, requiring the swage effect of new hard disk drives to be reduced to as little as possible. In this study, finite element analysis (FEA) was used to reduce the swage effect. At present, FEA and investigative tests indicate that a significant portion of gram changing through swaging is caused by E-block tip deformation due to swaging. Deformation of the E-block tip is the result of unbalanced swage forces between the tension and compression suspension. Achieving optimization concepts leads to a new swage plate design to reduce the gramload change of the target and to equalize the swage forces. The FEA results found that gramload change of the target decreased by 35% on the tension side, and by 65% on the compression side through swage by boss tower. The HGA torque out was not different. The suspension flange was also studied. Subsequently, suspension manufacturing is able to bias the suspension as incoming HGA. The flange deformation might be closer to zero after the swaging process.
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