Additive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates.
Process monitoring and modelling can contribute to fostering the industrial relevance of additive manufacturing. Process related temperature gradients and thermal inhomogeneities cause residual stresses, and distortions and influence the microstructure. Variations in wall thickness can cause heat accumulations. These occur predominantly in filigree part areas and can be detected by utilizing off-axis thermographic monitoring during the manufacturing process. In addition, numerical simulation models on the scale of whole parts can enable an analysis of temperature fields upstream to the build process. In a microscale domain, modelling of several exposed single hatches allows temperature investigations at a high spatial and temporal resolution. Within this paper, FEMbased micro-and macroscale modelling approaches as well as an experimental setup for thermographic monitoring are introduced. By discussing and comparing experimental data with simulation results in terms of temperature distributions both the potential of numerical approaches and the complexity of determining suitable computation time efficient process models are demonstrated. This paper contributes to the vision of adjusting the transient temperature field during manufacturing in order to improve the resulting part's quality by simulation based process design upstream to the build process and the inline process monitoring.
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