The eligibility of poly(vinylidene fluoride-trifluoroethylene) films for microsystem integration has been investigated with respect to strongly strain-reliant device designs such as for example vibration-based piezoelectric energy harvesting devices. Due to their ability to withstand extraordinary elongations, the integration of polymeric materials into appropriately designed devices is exceptionally promising and has been accordingly assessed. However, polymeric films often suffer from an immense sensitivity to many of the processing steps used during microfabrication like lithography. This contribution will show that this is not necessarily so. Functional films have been prepared and comprehensively characterized providing a benchmark for processing induced material deterioration. Further, the damage potential emanating from consecutive processing and lithographical pattern transfer steps was focused on. The inferred course of action was finally applied to the fabrication and vibrational proof of concept of a microsystem based on the polymeric material system poly(vinylidene fluoride-trifluoroethylene).
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