The use of structural adhesives has increased in recent years as an alternative to intrusive bonding methods. In order for an adhesive joint to be successfully executed, it is necessary to prepare the surface of the substrate, which can be done by different methods. The objective of this work was to make an overview of the main existing surface preparation methods for adhesive bonding and the range of parameters of interest, such as roughness and wettability, that can be obtained.
Equipment used in the exploration of pre-salt hydrocarbon fields can be subjected to high pressures. In this context, a structural component belonging to a seismic data acquisition device was redesigned considering the use of additive manufacturing. In this process, many geometries were obtained due to spatial constraints in the assembly of electronic components, sensors and their connections. Through numerical simulations, several tests were performed with geometries generated through topological optimization. The goal was to increase the available volume to accommodate electronic boards making the assembly easier and to reduce the component weight. At the end, this structural component called "central column" was redesigned with a superior performance than original designed component manufactured by milling.
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