Lignin-based wood adhesives are obtained that satisfy the requirements of relevant international standards for the manufacture of exterior-grade wood particleboard. Formulations based on low molecular mass lignin and presenting an increase in the relative proportion of reactive points yield better results than the higher molecular mass lignin used in the past. These lignins allow a higher proportion of hydroxymethylation during preparation of methylolated lignins. These lignin-based adhesives also yield acceptable results at particleboard pressing times that are sufficiently low to be of industrial significance. Lignin-based wood adhesives, in which a nonvolatile nontoxic aldehyde (glyoxal) is substituted for formaldehyde in their preparation, are prepared and tested for application to wood panels such as particleboard. The adhesives yield good internal bond strength results for the panels, which are good enough to comfortably pass relevant international standard specifications for exterior-grade panels. The adhesives also show sufficient reactivity to yield panels in press times comparable to that of formaldehyde-based commercial adhesives.
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