PurposeBowel preparation with sodium phosphate was recently prohibited by the U.S. Food and Drug Administration. Polyethylene glycol (PEG) is safe and effective; however, it is difficult to drink. To identify an easy bowel preparation method for colonoscopy, we evaluated three different bowel preparation regimens regarding their efficacy and patient satisfaction.MethodsIn this randomized, comparative study, 892 patients who visited a secondary referral hospital for a colonoscopy between November 2012 and February 2013 were enrolled. Three regimens were evaluated: three packets of sodium picosulfate/magnesium citrate (PICO, group A), two packets of PICO with 1 L of PEG (PICO + PEG 1 L, group B), and two packets of PICO with 2 L of PEG (PICO + PEG 2 L, group C). A questionnaire survey regarding the patients' preference for the bowel preparation regimen and satisfaction was conducted before the colonoscopies. The quality of bowel cleansing was scored by the colonoscopists who used the Aronchick scoring scale and the Ottawa scale.ResultsThe patients' satisfaction rate regarding the regimens were 72% in group A, 64% in group B, and 45.9% in group C. Nausea and abdominal bloating caused by the regimens were more frequent in group C than in group A or group B (P < 0.01). Group C showed the lowest preference rate compared to the other groups (P < 0.01). Group C showed better right colon cleansing efficacy than group A or group B.ConclusionGroup A exhibited a better result than group B or group C in patient satisfaction and preference. In the cleansing quality, no difference was noted between groups A and C.
A novel hybrid composite with low-melting-point alloy fillers was fabricated and characterized through differential scanning calorimeter analysis and viscosity test. Based on the chemo-rheological properties of the hybrid composite, the hybrid interconnection process was determined. The effect of the reduction capability of hybrid composite on the rheology-coalescence-wetting phenomenon of low-melting-point alloy fillers into the hybrid composite was investigated. The hybrid composite has a low viscosity and did not show excessive curing around the melting point of the used low-melting-point alloy material. The low-viscosity characteristic of hybrid composite and the loading of reductant accelerated rheology-coalescence-wetting phenomenon of low-melting-point alloy fillers in hybrid composite significantly. X-ray image and cross-section view revealed a stable metallurgical interconnection between upper and corresponding lower electrode in hybrid composite with reduction capability. This stable metallurgical interconnection was reflected in much improved mechanical and electrical properties of the hybrid interconnection.
Chip-on-film (COF) technology has been developed for liquid crystal displays (LCD) due to its high yield capability in fine pitch products. In this study, a new COF thermosonic (TS) bonding process using anisotropic conductive adhesive and ultrasonic vibrations will be introduced. Si chips with 16 cylindrical Cu bumps (¤100 µm) and polyimide (PI) film substrate with a thickness of 70 µm were prepared. For the bonding condition, the bonding temperature and ultrasonic time were varied from 413 to 453 K and from 0.5 to 1 s, respectively. Also, thermocompression (TC) bonding was conducted with a bonding temperature of 453 K and bonding time of 8 s to compare it to the bonding characteristics of TS bonding. The shear strength and electrical resistance of COF assemblies were measured to verify the feasibility of COF TS bonding using ACFs. The cross-sectional inspection and fracture surface analysis of COF joints were also conducted using field-emission scanning electron microscopy (FE-SEM). As a result, the mechanical and electrical properties of the COF assembly were improved by increasing the bonding temperature and ultrasonic dwell time. It was also determined that ultrasonic energy has a significant influence in improving the mechanical and electrical properties of the TS COF assembly.
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