To improve plasma and chemical resistance on various vacuum components used for semiconductor manufacturing equipment, various ceramic coating techniques have been applied. Among these methods for ceramic coating, the well-known atmospheric plasma spray (APS) is advantageous for providing thick film (100 µm or more) deposition. However, there are problems associated with the phase transition of the coating film and poor film quality due to formation of voids. To solve these problems, the aerosol deposition (AD) method has been developed. This method provides nice ceramic film quality. However, the coating rate is quite slow and has difficulty producing thick films (>30 µm). To overcome these limitations, microwave plasma-assisted aerosol deposition (μ-PAD) is applied at low vacuum conditions without the AD nozzle. This method uses a microwave plasma source during the AD process. After enduring a long-term durability test, as a trial run, μ-PAD has been applied on the actual process site. With the Al2O3 powder, μ-PAD shows a coating rate that is 12 times higher than the AD method. In addition, the formation of a thicker film (96 µm) deposition has been demonstrated. On the other hand, the coating film hardness, porosity, adhesion, and withstand voltage characteristics were confirmed to be less than the AD method.
The concept of a water surface plasma source (WSPS) was proposed to directly interact plasmas with water for large area water treatment, which is the type of volume dielectric barrier discharge (vDBD) with plate-to-plate. One electrode is submerged in water, while the other is floated in air, which is covered with a dielectric material. The characteristics of the WSPS were investigated by using a complementary metal-oxidesemiconductor (CMOS) camera, voltage and current probes, and optical emission spectroscopy (OES). The electrochemical parameters of plasma-activated water (PAW, 2 L) after plasma treatment times of 3 min by the WSPS were analyzed by using a multiparameter meter. As results, the formation of the water wave due to plasma generation, caused by the effect of the induced polarization forces, was observed at the WSPS. By comparison with the tap water, the applied voltage of the distilled water required higher than 130% for stable operation of the WSPS due to lower electrical conductivity (EC). As gap distance between dielectric plate and water surface increased, the applied voltage increased. In addition, an increase of 2 mm in the water level from the lower electrode required an approximately 5% increase in applied voltages for the ignition and stable plasma generation of the WSPS. The dominant peaks that were for N 2 species system in the spectrum of plasmas at the WSPS were analyzed by using the OES. In the case of distilled water, the pH values decreased from 6.25 to 4.24 and the EC increased from 2.00 to 22.33 µS • cm by using multiparameter meter during plasma treatment, whereas in the case of tap water, the effects on the pH and EC were insignificant.
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