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The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/adem.202101752.

Wearable electronics are new structures with a wide range of possible applications. This study aims to analyze the effects of hot pressing in thermal transfer of different carbon-based composites as a new application method of screen-printed electronics on textiles. Flexible heaters were screen-printed on polyethylene terephthalate PET foil with composites based on graphene, carbon black, and graphite with different wt.%, measured and then hot pressed to measure and analyze differences. Research showed that the hot pressing process in thermal transfer resulted in decreased electrical resistance, increased power, and higher maximal temperatures. Best results were achieved with composites based on 12 wt.% graphene with sheet resistance lowered by about 40% and increased power by about 110%. This study shows promise for thermal transfer and screen-printing combination as an alternative for creating flexible electronics on textiles.

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Low-temperature die-attaching pastes for wearable electronics are the key components to realize any type of device where components are additively manufactured by pick and place techniques. In this paper, the authors describe a simple method to realize stretchable, bendable, die-attaching pastes based on silver flakes to directly mount resistors and LEDs onto textiles. This paste can be directly applied onto contact pads placed on textiles by means of screen and stencil printing and post-processed at low temperatures to achieve the desired electrical and mechanical properties below 60 °C without sintering. Low curing temperatures lead to lower power consumption, which makes this paste ecological friendly.

The Low Temperature Joining Technique (LTJT) using silver compounds enables to significantly increase the thermal conductivity between joined elements, which is much higher than for soldered joints. However, it also makes difficult to measure the thermal conductivity of the joint. The Laser Flash Analysis (LFA) is a nonintrusive method of measuring the temperature rise of one surface of a specimen after excitation with a laser pulse of its other surface. The main limitation of the LFA method is its standard computer software, which assumes the dimensions of a bonded component to be similar to those of the substrate, because it uses the standard Parker's formula dedicated for one-dimensional heat flow. In the paper a special design of measured specimen was proposed, consisting of two copper plates of different size joined with the sintered silver layer. It was shown that heat properties of these specimens can also be measured after modifying the LFA method. The authors adapted these specimens by masking the false heat signal sourced from the uncovered plate area. Another adaptation was introducing a correcting factor of the heat travel distance, which was calculated with heat-flow simulations and placed into the Parker's formula. The heat-flow simulated data were compared with the real LFA measurement results, which enabled estimation of the joint properties, e.g. its porosity.

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