Driven by IC packaging and performance requirements, the die separation process is facing three main trends: Thinner wafers, stronger die and non-Silicon materials. Memory capacity increase, multichip functions and continuous package miniaturization require ultra thin wafer dicing. For IC performance increases, low-K material and other materials (top layers and even substrates) require different dicing methods for efficient and delamination free dicing processes. It is demonstrated that conventional blade dicing has reached the end of its capabilities and does not meet the separation requirements. Particular thin wafer development and the use of Die Attach Film (DAF) have added challenges and restrictions to the dicing technologies. Laser dicing processes have developed and have become the preferred dicing technology. This paper will discuss the various laser dicing technologies introduced for the different segments and will address the specific performances. Using a multibeam laser dicing process add significant advantages to the different solutions.
The traditional blade dicing technology has gone through an impressive evolution keeping up with quality, cost and miniaturization requirements that the semiconductor technology roadmaps introduced and specified. However, since wafer technologies have dropped below 90nm node and low k materials were introduced it became clear that blade dicing evolution is coming to an end and expensive hybrid solutions such as combined laser grooving processes and blade dicing technologies were required to achieve the desired product reliability. Similar situations have been seen with the ongoing trend to thinner wafers that are needed for miniaturization, 3D packaging and IC performance improvements. To achieve sufficient mechanical strength, complex dicing technologies and sequences have been introduced which do not respond to the requirements for current and near future technologies. This paper will discuss the multiple beam laser dicing technology, an enabling technology that allows semiconductor manufacturers to execute the technology roadmap and continue to comply to Moore's law in an efficient manner. The multiple beam laser dicing technology has already been widely adopted by several other semiconductor technologies (e.g. RFIC, LED, T&D) and has a proven track record. The paper will address how the grooving profile generated by the multi beams give a similar or better performance compared to the single beam grooving profiles. Together with large IDM's ALSI has done an evaluation of the saw blade yield for various grooving technologies. During the conference we will present the results which will demonstrate an equal or better saw yield with a high productivity.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.