Ultra-low-k time-dependent dielectric breakdown (TDDB) is one of the most important reliability issues in Cu/low-k technology development due to its weaker intrinsic breakdown strength compared to SiO2 dielectrics. With continuous technology scaling, this problem is further exacerbated for Cu/ultra-low-k interconnects. In this letter, the TDDB degradation behavior of ultra-low-k dielectric in Cu/ultra-low-k interconnects will be investigated by a method consisting of a combination of Raman with Fourier transform infrared vibrational microscopes. In TDDB tests on Cu/low-k interconnect, it was found that intrinsic degradation of the ultra-low-k dielectric would first occur under electrical field stress. Upon further electrical field stress, the ultra-low-k dielectric degradation would be accelerated due to Ta ions migration from the Ta/TaN barrier bi-layer into the ultra-low-k dielectrics. In addition, no out-diffusion of Cu ions was observed in our investigation on Cu/Ta/TaN/SiCOH structures.

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Presently two major limiting factors are hindering the failure analysis (FA) development during the semiconductor manufacturing process and technology improvement: (1) Impossibility of manual polishing on the edge dies due to the amenability of layer peeling off; (2) Abundant demand of multi-locations FA, especially focusing different levels of layers simultaneously. Aiming at resolving these limitations, here we demonstrate two unique high precision polishing methods by using focused ion beam (FIB) technique. One is the vertical top down chemical etching at the aimed location; the other one is the planar top down slicing. Using the FIB for delayering not only solves these problems mentioned above, but also offers significant advantages over physical planar polishing methods such as: (1) having a better control of the delayering progress, (2) enabling precisely milling at a region of interest, (3) providing the prevention of over-delayering and (4) possessing capability to capture images at the region of interest simultaneously and cut into the die directly to expose the exact failure without damaging other sections of the specimen.

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Comparing with much valuable research on vibrational spectroscopy on low-k dielectrics in different substrates, this paper investigates the vibrational spectroscopy of low-k and ultra-low-k dielectric materials on patterned wafers. It is found that both Raman and FTIR spectroscopy are necessary as complement to characterize low-k and ultra-low-k dielectric materials on patterned wafers. Significant differences in the Raman and FTIR spectra between low-k and ultra-low-k dielectric materials are also observed. Moreover, Raman spectroscopy has an advantage in analyzing the mixed structure of low-k/ultra-low-k and Cu at nanometer-scaled sizes. The results in this paper show that Raman combined with FTIR spectroscopy is an effective tool to characterize dielectric thin film properties on patterned wafers.

AC electrochemical etching in diluted potassium hydroxide (KOH) solution was optimized to fabricate tungsten (W) nanotips with a controllable sharpness and aspect ratio using an additional lift-up step. The final tip profile was dependent on the extent of interaction between the KOH solution and the side of the W surface, and effective bubble shielding effects near the apex region during the lift-up. Lateral etching rate along the W material was affected by parameters such as electrolyte–cathode positioning, etching voltage, and electrode size that influenced the flow or replenishment rate of OH− ions to the W surface submerged in the solution and at the meniscus region. With the lift-up step, the dense layer of bubbles that formed during etching could provide a good shield in minimizing the etch-back effects on the tip apex. Combining the above investigated effects, sharp nanotips with the required aspect ratio could be achieved with the enhanced lateral etching and the protective shield of bubbles.

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