This work investigates mechanical limitations of thin film materials on steel foil substrates for flexible electronic applications. A three layer structure consisting of 100μm thick stainless steel foil as the substrate, followed by 1μm thick spin-on-glass passivation layer and 0.3μm thick patterned aluminum interconnect layer on top with varying widths between 10-35μm. A collapsing radius test method was adopted for the bending experiment and an elliptical curve fit was used to facilitate the strain measurement. The failure strain of aluminum interconnect layer was detected by monitoring the continuity of the test circuit during the experiment. The corresponding results reveal that the passivation layer cracked at a tensile strain of 0.46% and delaminated at a compressive strain of 0.68%. The metal interconnect layer ruptured at a tension strain of 1.26% and delaminated from the substrate at a compressive strain of 1.22% due to the delamination of the passivation layer underneath.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
hi@scite.ai
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.