As a great potential renewable energy source, solar energy is going to become one of the most important energies in the world. Recently, there has been an enormous increase in the understanding of the operational principle of PV tools, which led to a sudden increase in the power conversion efficiencies of such tools. Solar modules vary under temperature changes and the change in temperature will affect the output power modules. In this paper a relation between efficiency, sun radiation and temperature is used and under cloudy climate is simulated so we can obtain desired efficiency by adjusting temperature around PV module.

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This paper presents an analytical solution of a thick walled cylinder composed of a functionally graded piezoelectric material (FGPM) and subjected to a uniform electric field and non-axisymmetric thermo-mechanical loads. All material properties, except Poisson's ratio that is assumed to be constant, obey the same power law. An exact solution for the resulting Navier equations is developed by the separation of variables and complex Fourier series. Stress and strain distributions and a displacement field through the cylinder are obtained by this technique. To examine the analytical approach, different examples are solved by this method, and the results are discussed.

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This paper focuses on pattern recognition of the best position of piezoelectric patches around the hole in a plate under tension to attain the maximum reduction in stress concentration factor. For this purpose, using particle swarm optimization algorithm, the area and the best location of piezoelectric patches are investigated and the optimum pattern recognition around the hole is presented. Then, the effect of increasing the area of piezoelectric patches and voltage on stress concentration reduction are investigated for all percentage area of piezoelectric patches. To confirm the results, by considering two experimental tests, the results are compared with those reported in presented paper.

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This paper focuses on the effects of stiffness ratio and thickness ratio on reducing stress concentration factor using piezoelectric patches in a rectangular plate with a hole, as a classical shape. Various locations of actuators and induction of positive/negative strains into the host plate are investigated and the best location of patches is presented. The study investigated the ratio effects and piezoelectric patches bounded on a rectangular host plate having various thicknesses and materials. Results show that the best position of actuators varies based on values of thickness and stiffness ratios of the host plate and piezoelectric patches. Also, the location of maximum stress concentration is transmitted from top and bottom of the hole to another point around the edge by changing the location of the piezoelectric actuators. To verify the results, some experimental tests are applied. The results show good agreement between the finite element analysis and experimental tests.