We
demonstrate area-selective atomic layer deposition (ALD) of
oxides on DNA nanostructures. Area-selective ALD of Al2O3, TiO2, and HfO2 was successfully
achieved on both 2D and 3D DNA nanostructures deposited on a polystyrene
(PS) substrate. The resulting DNA–inorganic hybrid structure
was used as a hard mask to achieve deep etching of a Si wafer for
antireflection applications. ALD is a widely used process in coating
and thin film deposition; our work points to a way to pattern oxide
materials using DNA templates and to enhance the chemical/physical
stability of DNA nanostructures for applications in surface engineering.
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