We report the melting of nanorod arrays of copper at temperatures much lower than its bulk melting point ͑1083°C͒. The Cu nanorods were produced by an oblique angle sputter deposition technique through a physical self-assembly mechanism due to the shadowing effect. The as-deposited nanorods were ϳ2300 nm in length, ϳ100 nm in diameter, and separated from each other with gaps varying between ϳ10 and ϳ30 nm. The melting process was investigated through the analysis of scanning electron microscopy, transmission electron microscopy, and x-ray diffraction measurements. Start of premelting ͑or surface melting͒ has been observed to occur at annealing temperature ϳ400°C under vacuum ͑10 −6 Torr͒. As the temperature was raised the arrays of Cu nanorods started to coalesce and formed a dense continuous film with a ͑111͒ texture at ϳ550°C. The results of this work may be useful for low temperature soldering applications.
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