Piezoelectric wafer active sensors are small, inexpensive, noninvasive, elastic wave generators/receptors that can be easily affixed to a structure. Piezoelectric wafer active sensor installation on the health-monitored structure is an important step that may have significant bearing on the success of the health monitoring process. The purpose of this paper is to explore the durability and survivability issues associated with various environmental conditions on piezoelectric wafer active sensors for structural health monitoring. The durability and survivability of the piezoelectric wafer active sensor transducers under various exposures (cryogenic and high temperature, temperature cycling, outdoor environment, operational fluids, large strains, fatigue load cycling) were considered over a long period of time. Both free piezoelectric wafer active sensors and bonded piezoelectric wafer active sensors on metallic structural substrates were used. Different adhesives and protective coatings were compared to find the candidate for piezoelectric wafer active sensor application in structural health monitoring. In most cases, piezoelectric wafer active sensors survived the tests successfully. The cases when piezoelectric wafer active sensors did not survive the tests were closely examined and possible causes of failure were discussed. The test results indicate that lead zirconate titanate piezoelectric wafer active sensors can be successfully used in a cryogenic environment; however, it does not seem to be a good candidate for high temperature. Repeated differential thermal expansion and extended environmental attacks can lead to piezoelectric wafer active sensor failure. This emphasizes the importance of achieving the proper design of the adhesive bond between the piezoelectric wafer active sensor and the structure, and of using a protective coating to minimize the ingression of adverse agents. The high-strain tests indicated that the piezoelectric wafer active sensors remained operational up to at least 3000 microstrain and failed beyond 6000 microstrain. In the fatigue cyclic loading, conducted up to 12 millions of cycles, the piezoelectric wafer active sensor transducers sustained at least as many fatigue cycles as the structural coupon specimens on which they were installed. State of the Art Piezoelectric wafer active sensors can send and receive ultrasonic Lamb waves and determine the presence of cracks, delaminations, disbands, and corrosion. In recent years investigators (Chang [1,2],
A key question that needs to be addressed and answered with regard to successfully implementing Structural Health Monitoring technologies in Air Force systems involves the long-term operability, durability, and survivability of integrated sensor systems and their associated hardware. Whether a sensor system is fully integrated within a structural material, or surface-bonded to the structure, a number of environmental and system level influences will tend to degrade the sensor system's performance and durability over time. In this effort, an initial sensor durability study was undertaken to better understand the performance and degradation of piezo wafer active sensor (PWAS) systems under adverse mechanical, temperature, and moisture conditions. A novel displacement-field imaging approach was utilized to understand the vibration characteristics of PWAS transducers placed in accelerated vibration, temperature-cycling, and moisture-cycling conditions. The results showed damage in the form of PWAS sensor cracking events, bond degradation and failure, as well as indications of performance variation and reduction due to the accelerated exposure levels. Future activities will focus on identifying critical durability and survivability issues through advanced sensor modeling and additional accelerated testing efforts, with the ultimate goal of improving the robustness of health monitoring systems through improved sensor system design and packaging.
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