The results of an experimental investigation of the average liquid film thickness are presented for vertical upward annular-mist two-phase flow, with and without heat transfer. The effects on the film thickness for variations in vapor flow rate, liquid flow rate, vapor density, and heat transfer are described. A correlation equation is presented for the local time-averaged thickness and for the droplet size distribution. In addition, an equation is given for the liquid film flow rate as a function of the average film thickness.

The results of a study on thermal modeling and analysis of hybrid microcircuits are presented. Parametric studies covering typical component mounting methods, bonding agent materials, and component spacing are described. Temperature profiles of substrates, component temperatures, and thermal resistances are presented. It is shown that the use of moly tabs can significantly reduce component temperature levels. Additionally, it is shown that thermal modeling can greatly aid the circuit designer in the layout and preliminary design phases.

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