This study presents a buffer bridge process that allows growing multiple
YBa2Cu3O7 − y
(Y123) grains from one top seed. This process uses a buffer bridge pellet (Y2BaCuO5
or Y123) to deliver the Y123 growth from one seed to several Y123 compacts.
The top seeded melt growth (TSMG) process combined with the buffer bridge
process facilitated the fabrication of several single-grained Y123 superconductors
using one seed. In addition to achieving the growth of multiple Y123 grains, this
process ensured a uniform distribution of superconducting properties of the top
surface because the seed/compact interface area (the number of seeds), which is the
route for the impurities from the seeds, was minimized. Additionally, the impurity
contamination from a seed was considerably suppressed using a buffer pellet. One
⟨110⟩
diagonal facet line, as a result of the corner-to-corner growth, developed on the top
surfaces of the prepared Y123 compacts, which is comparable to the x-like facet
line of the conventional TSMG processed samples. The trapped magnetic field (H) profiles
at 77 K of the prepared Y123 compacts, which were estimated using an Nd–B–Fe permanent magnet, showed
the H
contour map of a single-grain mode. The force–distance curves for the field cooled
and zero-field cooled Y123 compacts at 77 K showed high and reliable levitation
forces with a small deviation among compacts. The buffer bridge process
can be applied to a batch process for the mass production of single-grain
REBa2Cu3O7 − y
(RE: rare-earth elements) superconductors with uniform top surface properties.
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