This paper presents a critical review of the basic data concerning the physics and chemistry of low pressure SiH4 glow discharges used to deposit hydrogenated amorphous silicon films (a&: H). Starting with an updated table of thermochemical data, we analyze the gas-phase elementary processes consisting of i) electron-molecule collisions, ii) ion-molecule collisions, iii) neutral-neutral collisions, iv) other electron and ion collisions involving electron-ion and ion-ion recombination, electron attachment on radicals and detachment of anions, and v) cluster growth kinetics in dusty plasmas. Experimental data or theoretical estimates are given and discussed in terms of cross-sections, collision and reaction rate constants, and transport coefficients. We also analyze the surface processes and reaction probabilities of ions, radicals and molecules.

The relations between the surface reaction probability β of an atom or a radical in a reactive gas discharge, its diffusive flux to the wall, spatial density profile and temporal density decay during the postdischarge, are examined. Then, the values of β for H, SiH3, and Si2H5 on a growing a-Si:H film, and CH3 and C2H5 on an a-C:H film are derived from the temporal decay of radical densities during the discharge afterglow by using time-resolved threshold ionization mass spectrometry. For SiH3 on a-Si:H, β=0.28±0.03 in excellent agreement with previous determinations using other experimental approaches, and for Si2H5, 0.1<β<0.3. For H on a-Si:H, 0.4<β<1 and mostly consists of surface recombination as H2, while the etching probability of Si as SiH4 is only ε≈0.03 at 350 K in good agreement with other studies of H reaction kinetics on crystalline silicon. At high dilution of SiH4 in H2 the sticking probabilities of Si hydride radicals are affected by the flux of H atoms of hydrogen ions which enhances surface recombination at the expense of sticking. For CH3 or C2H5 on a-C:H it is shown that β is not constant during the discharge afterglow, decreasing from about 0.01 down to 0.001. This reveals that chemisorption of these radicals on the H-saturated a-C:H surface is entirely governed by the competition between desorption and creation of active sites by ion bombardment or H atoms. The differences between the surface reaction kinetics of SiH3 on a-Si:H and CH3 on a-C:H are discussed within a unified model of precursor-mediated chemisorption.