A series of new anionic PAGs, as well as PAG-bound polymers designed for use in 193 nm photoresist materials, have been synthesized and characterized. These novel materials provide optical transparency at 193 nm and also good etch resistance. PAG incorporated resists and PAG blended resists were exposed at a wavelength of 193 nm using an ASML 5500/950B optical lithography system with 0.63 NA. Exposed wafers were evaluated using SEM. The fluorine substituted PAG bound polymer and PAG blend resist provided a 110 nm (220 nm pitch) line/ space at 11.5, 13.0 mJ cm 22 , and 80 nm isolated features at 3 and 1 mJ cm 22 , respectively. The LER (3s) results showed that the fluorinated PAG bound polymer has LER values of 6.7 and 6.8 nm for isolated 80 nm and dense 110 nm lines, respectively, while the fluorinated PAG blend resist has LER values of 8.6 and 8.9 nm. The improvement may be due to the direct bonding of PAG into the polymer main-chain, which provides a more uniform distribution, thereby controlling acid diffusion and allowing a higher loading of PAG than the blend sample. The fluorine-free PAG bound or blend resists showed lower photospeed compared to photoresists based on fluorine-substituted PAGs.

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We have measured voltage-current characteristics for YBa2Cu307 thin films in magnetic fields from 5 T to ambient, including some in the millitesla range. In all cases, the resistivitycurrent density isotherms can be separated into two classes: those which exhibit upward curvature, and have constant resistivity at low currents, and those which exhibit downward curvature at all currents. These two classes of isotherms are separated by a field-dependent temperature Tg. For each field, the isotherms scale in a manner consistent with a three-dimensional vortex-liquid to vortex-glass phase transition. The region that can be scaled is several kelvin at 5 T and narrows with decreasing field. The low-current resistivity above Ts varies as l 1 -T/Ts l with s =7.4 at all fields, but the critical scaling exponents z and v become field dependent below about 10 m T.

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Summary: A new series of functionalized anionic photoacid generators (PAGs), and corresponding polymers were prepared in moderate to good yield and characterized. The thermostability of PAG bound polymers was superior to PAG blend polymers. The fluorine‐free PAG bound or blend polymers exhibited higher stability than fluorine‐substituted PAG bound or blend polymers. Although the acid generating efficiency of PAG blend polymers was higher than that of PAG bound polymers, yet it is anticipated that PAG incorporated into the polymer main chain may improve acid diffusion compared with the PAG blend polymers. This was demonstrated by preliminary electron beam lithography (EBL) results: the fluorine PAG bound polymer resist HE‐F4‐MBS‐TPS gave 35 nm 1:1 L/S and showed better resolution than the blend sample HE Blend F4‐IBBS‐TPS. The PAG bound resist showed the capability for higher resolution, since 30 nm 2:1 L/S patterned. Based on these preliminary EBL results, the PAG bound polymer samples are anticipated to have a resolution capability for the 32 nm node for EUVL.