Copper corrosion products originated by the action of formic acid vapours at 40% and 80% relative humidity for a period of 21 days were analysed. Three formic vapour concentration levels (10, 100 and 300 ppm) were generated in laboratory tests at 30°C. The corrosion product layers were characterised using X‐ray photoelectron spectroscopy (XPS) in conjunction with Ar+‐ion sputtering. The components identified in the patina layers were cuprite (Cu2O), copper hydroxide (Cu(OH)2) and copper formate (Cu(HCOO)2). Copper formate was formed by a complex mechanism including copper hydroxide and formic acid.
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A study was made of the copper corrosion rate and corrosion products originated by the action of acetic acid vapor at 100% relative humidity. Copper plates were exposed to an acetic acid contaminated atmosphere for a period of 21 days. Five acetic vapor concentration levels were used. The copper corrosion rate was in the range of 1 to 23 mg/din2 day. The corrosion-product layers were characterized using electrochemical, X-ray powder diffraction, Fourier transform infrared spectrometry, and scanning electron microscopy techniques. Thermal and calorimetric studies were also performed. Some of the compounds identified were cuprite (Cu,O), copper acetate hydrate [Cu(CH,COO)22H,O], and copper hydroxide acetate [Cu4(OH)(CH,COO)72H20]. This last compound was also characterized. The thickness of the patina layers was 4 to 8 nm for amorphous cuprite, 11 to 48 nm for cuprite, and 225 nm for copper acetate. The patina, in which the cementation process of different corrosion-product layers plays an important role, is formed by the reaction of acetic vapor with copper through porous cuprite paths.
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