Thin film nickel‐phosphorus alloys are electrodeposited at a high rate using a specialized rapid electrolyte flow system. Current densities up to 2.33 A/cm2, which are difficult to maintain in conventional plating processes, can be used to produce satisfactory films. The deposits are characterized by x‐ray diffraction and differential scanning calorimetry. Phosphorus content decreases with increasing current density and is virtually independent of the electrolyte flow rate above 5.7 m/s, where the system is operating in the turbulent regime. Deposit structure depends strongly on the phosphorus content; it is amorphous or highly microcrystalline at >14 atom percent (a/o) and crystalline at <14 a/o. The low phosphorus deposits decompose directly from a solid solution of nickel and phosphorus to a mixture of nickel and nickel phosphide
false(Ni3Pfalse)
at a temperature in the range of 380°–420°C. The high phosphorus deposits transform first to a metastable intermediate
false(NixPyfalse)
which subsequently transforms to nickel and nickel phosphide at higher temperatures.
ChemInform Abstract in a specialized rapid electrolyte flow system using current densities of up to 2.33 A/cm2 are studied by XRD and DSC. The P content of the films decreases with increasing current density and is independent of the electrolyte flow rate above 5.7 m/s. The structure of the deposits depends on the P content; above 14 at.% P, the films are amorphous or highly microcrystalline, whereas they are crystalline below 14 at.% P. The low phosphorus deposits decompose in the range 380-420 rc C to form a mixture of Ni and Ni3P, wheras the high phosphorus solid solutions transform to a metastable intermediate, NixPy, which subsequently transforms to nickel and nickel phosphide at higher temperatures.
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