A novel cover layer material for flexible printed circuit (FPC) applications was developed in this work. A high molecular weight of polyimide composed of four monomers, pyromellitic dianhydride (PMDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 2,2'-bis(trifluoromethyl)benzidine (TFMB) and 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BisApAf) was prepared by the onepot polycondensation in N-methyl-2-pyrrolidone (NMP) without precipitation and gelation. The polyimide (PI) was highly soluble in various common organic solvents. Interestingly, the PI film formed by simple solution-casting of the PI solution had a low CTE value close to that of copper foil, therefore almost no curling of the PI/copper laminate was observed when the PI film was directly formed on a copper foil. The PI film also exhibited other combined properties, including a low CTE, a high T g , high thermal stability, low water absorption, comparatively good transparency, the highest levels of non-flammability, good insulation properties and sufficient film flexibility. In addition, fine positive-tone patterns could be obtained from DNQ-containing PI with a sensitivity of 238 mJ cm 12 . The results revealed that the present PI system is a promising candidate as a novel cover layer material.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
customersupport@researchsolutions.com
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.