A scalable approach for the mass production of chemically modified graphene has yet to be developed, which holds the key to the large‐scale production of stable graphene colloids for optical electronics, energy conversion, and storage materials, catalysis, sensors, composites, etc. Here, a facile approach to fabricating covalently modified graphene and its polymer nanocomposites is presented. The method involves: i) employing a common furnace, rather than a furnace installed with a quartz tube and operated in inert gas as required in previous studies, to treat a commercial graphite intercalation compound with thermal shocking and ultrasonication and fabricate graphene platelets (GnPs) with a thickness of 2.51 ± 0.39 nm that contain only 7 at% oxygen; ii) grafting these GnPs with a commercial, long‐chain surfactant, which is able to create molecular entanglement with polymer matrixes by taking advantage of the reactions between the epoxide groups of the platelets and the end amine groups of the surfactant, to produce chemically modified graphene platelets (m‐ GnPs); and iii) solution‐mixing m‐GnPs with a commonly used polymer to fabricate nanocomposites. These m‐GnPs are well dispersed in a polymer with highly improved mechanical properties and a low percolation threshold of electrical conductivity at 0.25 vol%. This novel approach could lead to the future scalable production of graphene and its nanocomposites.
In spite of extensive studies conducted on carbon nanotubes and silicate layers for their polymer-based nanocomposites, the rise of graphene now provides a more promising candidate due to its exceptionally high mechanical performance and electrical and thermal conductivities. The present study developed a facile approach to fabricate epoxy-graphene nanocomposites by thermally expanding a commercial product followed by ultrasonication and solution-compounding with epoxy, and investigated their morphologies, mechanical properties, electrical conductivity and thermal mechanical behaviour. Graphene platelets (GnPs) of 3.57 AE 0.50 nm in thickness were created after the expanded product was dispersed in tetrahydrofuran using 60 min ultrasonication. Since epoxy resins cured by various hardeners are widely used in industries, we chose two common hardeners: polyoxypropylene (J230) and 4,4 0 -diaminodiphenylsulfone (DDS). DDS-cured nanocomposites showed a better dispersion and exfoliation of GnPs, a higher improvement (573%) in fracture energy release rate and a lower percolation threshold (0.612 vol%) for electrical conductivity, because DDS contains benzene groups which create p-p interactions with GnPs promoting a higher degree of dispersion and exfoliation of GnPs during curing. This research pointed out a potential trend where GnPs would replace carbon nanotubes and silicate layers for many applications of polymer nanocomposites.
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