Cell death is an important process of plant responses to development and biotic/abiotic stresses. In rice plants, PBZ1, a PR10 family protein, has been shown to accumulate in tissues undergoing cell death. However, the function of PBZ1 in cell death remains yet to be demonstrated. Here, we report that exogenous recombinant PBZ1 protein induces cell death in rice suspension-cultured cells (SCCs) and also in leaves of Nicotiana tabacum in a dosedependent manner. This finding was confirmed in vivo in transgenic Arabidopsis lines harboring the PBZ1 gene under the control of a dexamethasone (DEX)-inducible promoter. The DEX-treated leaves of transgenic Arabidopsis induced expression of PBZ1 at transcript and protein levels and showed cell death morphology. TUNEL analysis detected DNA fragmentation, a hallmark of programmed cell death, in rice SCCs treated with the PBZ1 protein. Recombinant PBZ1 protein also exhibited RNase activity and exhibited internalization inside BY-2 cells. Taken together, PBZ1 induces cell death not only in rice, but also in tobacco and Arabidopsis via its RNase activity inside the cell. PBZ1 could be used as a marker to understand the mechanism by which PBZ1 confers the cell death morphology in rice and other model plants.

The infectious bronchitis virus (IBV) is continuously evolving through point mutation and recombination of their genome, subsequently the emergence of IBV variants complicates disease control. The objective of this study was to investigate genetic characterization of new IBV variants isolated from commercial chicken flocks in Korea collected between 2005 and 2010. Phylogenetic analysis revealed that all new IBV isolates belonged to Korean group II (K-II), which included the nephropathogenic IBV strains. However, the isolates formed a new gene cluster that was distinguished from the two distinct K-II subgroups (KM91-like and QX-like). Recombination events were identified in the S1 gene, with their putative parental strains being the KM91-like or QX-like subgroup. In addition, two crossover sites were observed in the S1 gene of IBV isolates. These results suggest that natural genetic recombination between heterologous strains classified into different genetic groups has occurred and may have caused the emergence of new IBV strains. This finding provides important information on IBV evolution and is essential for the effective control of IB in Korea.

In this paper, resistance spot weldability of high‐Mn steels were investigated in order to get high reliability in welded joints of automotive components. Microstructural characterizations, cross‐tensile test (CTT), microhardness tests of spot welded parts were conducted. The effects of weld current on the microstructural characteristics, mechanical properties, and fracture modes were investigated using optical microscopy (OM) and scanning electron microscopy (SEM). The hardness in the weld nugget was observed to be lower than that in the base metal (BM). In CTT, the failure initiation was observed to occur at the boundary of the weld nugget. Also welding imperfections of welded parts were investigated. Liquation cracking in heat affected zone (HAZ), porosity, and shrinkage cavity were found most common welding defects in welded parts. Furthermore, the effects of welding imperfections on weld quality and failure criteria were identified and discussed.

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Owing to the trend of faster and denser circuit design, the dielectric properties of packaging materials for semi‐conductors will have greater influence on performance and reliability. Also, as chips become more densely packaged, thermal dissipation becomes a critical reliability issue. Consequently, four important properties for manufacturing semi‐conductor packaging are: low values of dielectric constants, high values of thermal conductivity, relatively low values of thermal expansion coefficients, and low cost. Thus, in this study, AlN (Aluminum Nitride) was selected as the filler for an epoxy matrix to achieve increased performance of an EMC. As a result, the thermal conductivity of an EMC filled with 70 vol% of AlN increased as much as 7–8 times compared with the EMC filled with a crystalline silica (vol. 70%). When more than 60 vol% of AlN was added to the EMC, the dielectric constants and thermal expansion coefficient decreased rapidly.