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This article presents a robust and efficient methodology to study three‐dimensional thermoelastic contact problems under orthotropic friction conditions, including the effects of non‐linear thermal contact conductance and convective boundary conditions at the interstitial contact zone. The proposed methodology considers the boundary element method to compute the thermomechanical influence coefficients and an augmented Lagrangian formulation to ensure the fulfillment of all these thermomechanical contact conditions. The resulting non‐linear equation set have been solved by an efficient proposed iterative Uzawa scheme. The proposed formulation has been validated by comparison with some available results in the literature and later on, it is considered to study how the thermoelastic contact variables are affected by both: the non‐linear interface thermal and the orthotropic friction conditions in different engineering problems such as a brake disc‐pad contact system.

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This paper presents a simulation based on the boundary element method for the optimization of the thermomechanical behavior of three-dimensional microchip-dissipator packaging when the heat generation produced is medium-low. Starting from a basic architecture studied in the literature, different modifications affecting both elastic boundary conditions and the contact interface between the microprocessor and the heatsink are included and studied in order to improve heat dissipation. A nonlinear interface material is included at the interface of both solids. Thus, a thermal contact conductance as a function of the normal contact traction is simulated. Finally, all these improvements in both contact interface and boundary conditions are applied to study the maximum heat generation that this kind of architecture can efficiently dissipate, so that the microchip will not be damaged due to thermal deformations.