The effects of process parameters on bond formation in thermosonic gold ball bonding on a copper substrate at ambient temperatures have been investigated with scanning electron microscopy (SEM). A model was developed based on classical microslip theory to explain the general phenomena observed in the evolution of bond footprints left on the substrate. The specific effects of ultrasonic energy and complex stress distributions arising from tool geometry must be taken into consideration and were incorporated into the model. It was shown that relative motion existed at the bonding interface as microslip at lower powers, transitioning into gross sliding at higher powers. With increased normal bonding forces, the transition point into gross sliding occurred at higher ultrasonic bonding powers.

The effects of the process parameters of ultrasonic power and normal bonding force on bond formation at ambient temperatures have been investigated with scanning electron microscopy (SEM) and energy-dispersive x-ray (EDX) analysis. A model was developed based on classical microslip theory 1 to explain the general phenomena observed in the evolution of bond footprints left on the substrate. Modifications to the model are made due to the inherent differences in geometry between ball-bonding and wedge-bonding. Classical microslip theory describes circular contacts undergoing elastic deformation. It is shown in this work that a similar microslip phenomenon occurs for elliptical wireto-flat contacts with plastically deformed wire. It is shown that relative motion exists at the bonding interface as peripheral microslip at lower powers, transitioning into gross sliding at higher powers. With increased normal bonding forces, the transition point into gross sliding occurs at higher ultrasonic bonding powers. These results indicate that the bonding mechanisms in aluminum wire wedge-bonding are very similar to those of gold ball-bonding, both on copper substrate. In ultrasonic wedge-bonding onto copper substrates, the ultrasonic energy is essential in forming bonding by creating relative interfacial motion, which removes the surface oxides.

Electrode pitting was investigated in resistance spot welding of 1.5-mm-thick sheet aluminum alloy 5182 using a medium-frequency direct-current welder and electrodes with a tip face curvature radius of 50 mm and tip face diameter of 10 mm. Detailed investigation of the metallurgical interactions between the copper electrode and aluminum alloy sheet was carried out using scanning electron microscopy/energy-dispersive X-ray spectroscopy (SEM/EDX) and X-ray diffraction (XRD). The results indicated that electrode degradation, which eventually leads to weld failure, proceeded in four basic steps: aluminum pickup, electrode alloying with aluminum, electrode tip face pitting, and cavitation. Since pitting and cavitation result from Al pickup and alloying, periodic electrode cleaning could extend electrode tip life by limiting the buildup of Al on the tip face. This work is part of the effort to improve electrode tip life in resistance spot welding of aluminum alloys for automotive applications.

The effects of superimposed ultrasound vibration on plastic deformation of gold are studied both during and after the vibration using an ultrasonic ball bonding machine. It is found that when ultrasonic irradiation is applied along with mechanical force, the metal is softer than when deformed without the vibration. After ultrasound is turned off, the deformed metal remains softer if previously deformed with ultrasound. Possible mechanisms for the acoustic residual softening are discussed as compared to residual hardening. The acoustic residual effect is attributed to the net balance between ultrasound’s dynamic annealing and its potential opposing effect on activating and multiplying dislocations.

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