This paper analyzes the influence of the composition of screen printing metal pastes on contacting boron emitters for crystalline silicon solar cells, optimized on the basis of commercial Ag‐paste Ferro 3347 by adding silicon and aluminum. Aluminum provides a lower contact resistance, while silicon prevents the spiking and alloying of aluminum with the silicon of the substrate. The best pastes have turned out to be high Si‐concentrated, which have provided a final specific contact resistance of 3–4 mΩ cm2 on screen printed boron emitters diffused at 1000°C for 8 min, with shunt conductance lower than 0.6 mS/cm2. The final fill factors have been better than 77.5% and open circuit voltages have exceeded 605 mV on Czochralski (Cz) n type 0.7 Ω cm solar cells. These results have proven the feasibility of our screen printing process for p+nn+ structures. Copyright © 2009 John Wiley & Sons, Ltd.

Dedicated to the memory of Prof. Michael Bendikov and his many contributions to the field of organic electronics

No abstract

The present study addresses the metallization and characterization of thin (~110 µm) crystalline silicon solar cells with a sprayed-on emitter prepared from orthophosphoric acid aqueous solutions and commercial spin-on dopants. The feasibility of such process especially for thin cells is analyzed, as well as the characteristics which derivate from the use of each precursor. The use of passivating and antireflective coatings on these devices has been essayed. The performance has been compared with that of cells prepared by an industrial process and featuring a traditional antireflective coating. Shunt resistance has been found to be the main limiting factor in order to increase cell efficiency, probably associated with microcracks due to the fragility of the cell. The characterization and the analytical model suggest that this method could produce cells exceeding 17% efficiency.This journal is

No abstract