SUMMARYThis paper presents a way to design a finite-element computer model of cooling system with a complicated geometry. The computer model is developed on the basis of a commercial software package ABAQUS. The steady state forced-convective fluid cooling of a pin-fin heat converter for power ($1 kW heat power) semiconductor module has been investigated on the basis of computer simulation. A phenomenological equation has been used for calculation of the local value of the heat transfer coefficient for the liquid-solid interface. The impacts of the thermal conductivity of the pin-fin sink material, volume flow rate of the cooling liquid and geometrical design of the pin-fin sink on the thermal resistance of the converter are shown.
Our experiments show a hydrogen plasma assisted creation of p-n junctions in p-type Cz silicon due to a hydrogen enhanced thermal donor (TD) formation at temperatures ≤450 °C. Applying DC or HF plasma treatments a conversion of p-type into n-type Cz silicon by TD formation occurs. One can distinguish one step processes (p-n junction formation appears just after the plasma exposure) and two step processes (p-n junction formation requires subsequent post hydrogenation annealing). The samples are studied by depth resolved spreading resistance probe (SRP), capacitance-voltage (CV) and Hall measurements. For the one step processes a kinetic model for hydrogen enhanced TD formation is presented.
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