Saliva contamination significantly affects the bond strength of one-step self-etching adhesive systems to dentin; therefore, saliva contamination must be avoided when using these systems. ©Operative Dentistry, 2006, 31-1, 127-134 SUMMARYThis study evaluated the effect of saliva contamination and decontamination methods on the dentin bond strength of one-step self-etching adhesive systems. Three commercially available "all-in-one" adhesives (One Up Bond F, Xeno III and Adper Prompt) and one resin composite (Filtek Z-250) were used. Third molars stored in distilled water with 0.5% thymol at 4°C were ground with #600 SiC paper under running water to produce a standardized smear layer. The specimens were randomly divided into groups according to contamination methods: no contamination, which was the control (C); contamination of the adhesive surface with fresh saliva before light curing (A) and contamination of the adhesive surface with fresh saliva after light curing (B). Each contamination group was further subdivided into three subgroups according to the decontamination method: A1-Saliva was removed by a gentle air blast and the adhesive was light-cured; A2-Saliva was rinsed for 10 seconds, gently air-dried and the was adhesive lightcured; A3-Saliva was rinsed and dried as in A2, then the adhesive was re-applied to the dentin surface and light-cured; B1-Saliva was removed with a gentle air blast; B2-Saliva was rinsed and dried; B3-Saliva was rinsed, dried and the adhesive was re-applied and light cured. Tygon tubes filled with resin composite were placed on each surface and light cured. All specimens were stored in distilled water at 37°C for 24 hours. Microshear bond strength was measured using a universal testing machine (EZ test), and data were analyzed by one-way ANOVA followed by the Duncan test to make comparisons among the groups (p<0.05). After debonding, five specimens 128Operative Dentistry were selected and examined in a scanning electron microscope to evaluate the modes of fracture.The A2 subgroup resulted in the lowest bond strength. For One Up Bond F and Adper Prompt, there was no significant difference between subgroup A1 and the control, and subgroup A3 and the control (p>0.05). Bond strengths of all B groups were significantly lower compared to the controls (p<0.05). For Xeno III, A1 subgroup showed the greatest decrease in bond strength as compared to the control (p<0.05). On the other hand, it showed more resistance to salivary contamination after adhesive curing. There was no statistically significant difference among the control groups (p>0.05).
This study evaluated the effect of blood contamination and decontamination methods on the microtensile bond strength of 1-step self-etching adhesive systems to dentin contaminated after adhesive application and light curing. Three commercially available "all-in-one" adhesives (One Up Bond F, Xeno III and Adper Prompt L-Pop) and 1 resin composite (Clearfil AP-X) were used. Third molars that had been stored in distilled water with 0.5% thymol at 4 degrees C were ground with #600 SiC paper under running water to produce a standardized smear layer. The specimens were randomly divided into groups according to the 3 adhesive systems. The adhesive systems were used under 3 conditions: no contamination, which was the control (C); contamination of the light-cured adhesive surface with blood and reapplication of adhesive (Contamination 1) and contamination of the light-cured adhesive surface with blood, then washing, drying and reapplication of the adhesive (Contamination 2). Following light curing of the adhesive, the resin composite was placed in 3 increments up to a 5-mm-thick layer on the bonded surface. All specimens were stored in distilled water at 37 degrees C for 24 hours. The microtensile bond strength was measured using a universal testing machine (EZ test), and data were analyzed by 1-way ANOVA followed by the Duncan test to make comparisons among the groups (p=0.05). After debonding, 5 specimens were selected from each group and examined in a scanning electron microscope to evaluate the modes of fracture. For all adhesives, contamination groups showed lower bond strength than the control (p<0.05). There was no statistically significant difference among the control groups (p>0.05). For Xeno III and Adper Prompt L-Pop, contamination group #2 showed the lowest bond strength among the groups (p<0.05). For One Up Bond F, contamination group #2 showed higher bond strength than contamination group #1 but showed no statistical significance between them (p>0.05).
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